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Packing and Characterizing High- power Laser Diode / Au, Thi Huong

Tác giả : Au, Thi Huong

Nhà xuất bản : H. : ĐHQGHN

Năm xuất bản : 2016

Tùng thư : Vol. 32;No. 3 (2016)

Chủ đề : 1. beam quality. 2. die bond technology. 3. Divergence Angle. 4. electro-optical conversation efficiency. 5. fiber – coupled. 6. Laser diode. 7. PVI characteristics. 8. wire bond technology. 9. Article.

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Tóm tắt :

In the manufacturing processes of high-power laser diode modules, the module packaging technologies play an important role; decide the efficiency of the electro-optical conversation, the beam quality and the lifetime. This paper presents the packaging of high-power laser diode modules from single chip, evaluating the electro-optical characteristics and the beam quality of the modules. The obtained results show that the packaged module has an output optical power of 5 W at current 5.9 A; the Operation Voltage is 1.7 V; the Threshold Current is 1,0 A; the Divergence Angle Mean is 36.8 degree and the Asymmetry is 1.04. These parameters are almost the same that of some on-stock modules. Thus, the application of the packaged module in social – economics is possible.
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https://repository.vnu.edu.vn/handle/VNU_123/55523